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LS-DYNA® Conference 2020 & Call for Papers

At a Glance:

  • Date: May 31 - June 2
  • Ho­tel: De­troit Mar­riott at the Re­nais­sance Cen­ter (book by May 20)
  • Cours­es: May 31 and June 3 - 4
  • Reg­is­tra­tion Fee: \$650 (\$325 for students)
  • One day pre-con­fer­ence class price: \$350 (\$175 for students)
  • Two day post-con­fer­ence class price: \$650 (\$325 for students)
  • Reg­is­tra­tion: Opens on Feb 18, Reg­is­ter by May 25
  • Ab­stract Sub­mis­sion Dead­line: Nov 30, 2019 (ex­tend­ed dead­line)
  • Pa­per Sub­mis­sion Dead­line: Mar 31
  • Con­tact: con­fer­

LS-DYNA® Conference 2020 & Call for Papers

The 16th In­ter­na­tion­al LS-DY­NA Con­fer­ence is sched­uled to start on the 31st of May, 2020. These con­fer­ences are a tra­di­tion at LST, LLC. They pro­vide a unique op­por­tu­ni­ty for LST, LLC de­vel­op­ers to meet with cus­tomers and for every­one in the LST, LLC com­mu­ni­ty to show­case what they've been do­ing. This con­fer­ence in­cludes a ban­quet, a re­cep­tion, and an ex­hi­bi­tion hall. The pri­ma­ry fo­cus of the con­fer­ence is the tech­ni­cal pre­sen­ta­tions. With over 975 at­ten­dees in 2018, this con­fer­ence is an ex­cel­lent op­por­tu­ni­ty for net­work­ing. A pre­sen­ta­tion at the LS-DY­NA con­fer­ence will have the at­ten­tion of LST, LLC de­vel­op­ers, prod­uct de­sign en­gi­neers, in­dus­try lead­ers, con­sul­tants, pro­fes­sors, re­searchers, stu­dents, and oth­er in­ter­est­ed par­ties.


Reg­is­tra­tion to at­tend the con­fer­ence will open on Feb 18. Please reg­is­ter at http:/­/­­d/­5hqy53/­4W. You must reg­is­ter by May 25. No on-site reg­is­tra­tion will be per­mit­ted.

Conference Dates

  • Sun­day 5/­31/­2020
    • Reg­is­tra­tion, Ex­hi­bi­tion Booths, Pre-Con­fer­ence Class­es, and Re­cep­tion
  • Mon­day 6/­1/­2020
    • Reg­is­tra­tion, Ex­hi­bi­tion Booths, Ple­nary, Keynote, Pa­per Pre­sen­ta­tions, and Ban­quet
  • Tues­day 6/­2/­2020
    • Reg­is­tra­tion, Ex­hi­bi­tion Booths, Pa­per Pre­sen­ta­tions, and Clos­ing
  • Wednes­day-Thurs­day 6/­3/­2020-6/­4/­2020
    • Reg­is­tra­tion for Post-Con­fer­ence Class­es

Call for Papers

LST, LLC con­sid­ers the tech­ni­cal pre­sen­ta­tions to be the most im­por­tant fea­ture of the LS-DY­NA con­fer­ence. Any­body want­i­ng to make a pre­sen­ta­tion at the con­fer­ence must sub­mit a pa­per cor­re­spond­ing to what your pre­sen­ta­tion will cov­er. We will not ac­cept a pre­sen­ta­tion with­out a pa­per. While we ex­pect that most pa­pers will fit in the cat­e­gories list­ed be­low, pa­pers out­side of those top­ics are al­so wel­come. If you have any ques­tions about sub­mit­ting a pa­per, email pa­ Pre­vi­ous con­fer­ence pa­pers can be viewed here.

Once your pa­per has been ac­cept­ed we will waive your reg­is­tra­tion fee (for pa­pers hav­ing mul­ti­ple co-au­thors on­ly one co-au­thor can re­ceive this waiv­er). To re­ceive this waiv­er you must be stay­ing at the Mar­riott De­troit Re­nais­sance Cen­ter un­der the group reg­is­tra­tion code "LSTC Con­fer­ence." If you live lo­cal­ly, please con­tact pa­

Ab­stracts should be sub­mit­ted to www.dy­­pa­per2020 no lat­er than No­vem­ber 30, 2019 (ex­tend­ed dead­line). Ab­stracts are lim­it­ed 2500 char­ac­ters. We will let you pick the most ap­pro­pri­ate ses­sion for your pa­per, and we will do our best to ac­com­mo­date your de­sired ses­sion. If we are not able to, we will fit your pa­per in­to one of the ses­sions list­ed be­low. You will be no­ti­fied with­in a week af­ter your sub­mis­sion that we have re­ceived your ab­stract. Pa­pers must be sub­mit­ted no lat­er than March 31, 2020. They must be un­der 3000 words and must be sin­gle spaced on 8.5" X 11" pa­per. A Mi­crosoft Word doc­u­ment will be pro­vid­ed to you to use as a tem­plate.

Session Categories

  • Aero­space
  • Au­to­mo­tive
  • Bio­med­ical
  • Blast
  • Com­pos­ites
  • Com­put­ing Tech­nol­o­gy
  • Con­sti­tu­tive Mod­el­ing
  • Con­nec­tions
  • Elec­tro­mag­net­ics
  • FSI/­ALE
  • ICFD
  • Im­plic­it
  • Iso­ge­o­met­ric Analy­sis (IGA)
  • Met­al Form­ing
  • Mod­el­ing
  • NVH
  • Oc­cu­pant Mod­el­ing
  • Oc­cu­pant Pro­tec­tion
  • Op­ti­mizia­tion
  • Post-Pro­cess­ing
  • Sim­u­la­tion
  • SPG
  • SPH
  • Ther­mal
  • Topol­o­gy & Op­ti­miza­tion
  • Oth­er (please spec­i­fy)